Gotmic bare-die GaAs pHEMT MMICs give engineers amplifiers, multipliers and mixers for building mmWave signal chains across 57 to 114 GHz.

Why mmWave signal chains start at the die

Above 50 GHz, every millimeter of interconnect shows up in your link budget. Bare-die MMICs let you place the amplifier, multiplier or mixer directly on your substrate, keep transitions short and tune the RF path around the device instead of around a connector.

That is the idea behind the Gotmic line distributed by HASCO: focused building blocks for the three jobs every mmWave chain has to do. Boost a signal, generate a higher frequency from a lower one, and convert between RF and IF. The range runs from V-band (57 GHz) through E-band to W-band (114 GHz), and the parts are supplied as bare die in gel-pack quantities.

Amplify, generate, convert

Start with the function, then narrow by RF band, gain or output power, LO architecture, IF bandwidth, drive level and packaging.

Amplifiers. Low-noise, medium-power and power-amplifier MMICs cover receiver sensitivity, driver stages and high-output transmitter chains. Browse MMIC amplifiers.

Frequency multipliers. Buffered X4, X6 and X8 devices generate mmWave local-oscillator and signal frequencies efficiently, with strong harmonic isolation. A multiplier lets you work from a lower-frequency source instead of distributing a high-frequency LO across the board. Browse MMIC multipliers.

Mixers. Fundamental and IQ up/down-converters are designed for low conversion loss, high isolation and wide IF bandwidths, supporting upconversion and downconversion in mmWave transceivers. Browse MMIC mixers.

Treat RF, thermal and assembly as one problem

Bare die gives you control, and it also moves responsibility for the package onto your design. Four areas to plan together:

1. Ground and thermal path. Back metallization serves as ground. Provide a low-inductance electrical connection and an effective heat path with a qualified attach process.
2. RF transitions. Keep bond wires short and controlled. Simulate pad, bond and transmission-line discontinuities across the intended operating band.
3. Bias and stability. Follow the current bias sequence, bypassing and operating limits. Review detector connections and thermal behavior where provided.
4. Handling and documentation. Plan ESD controls, die handling, storage and inspection. Request the latest datasheet, assembly guidance and CAD data before release.

Where these parts fit

• Defense and radar: high-frequency transmit, receive and sensing chains.
• Point-to-point radio: spectrally efficient V- and E-band communications.
• Test and measurement: frequency extension, sources and custom characterization hardware.
• Imaging and sensors: compact mmWave chains for active sensing platforms.

From band requirements to an orderable configuration

HASCO supports device selection, documentation and order planning, and is AS9120:B and ISO 9001:2015 certified. To get a recommendation or quote, send:

• RF and IF frequency ranges and the function you need
• Gain, conversion or output-power target and your LO plan
• Bias constraints and package or assembly needs
• Die quantity, application, end use and required delivery date

Explore the full Gotmic V-, E- & W-band MMIC page for the complete comparison and specifications, or start your quote request. You can also call 888-498-3242 or email sales@hasco-inc.com.